1.Immersion gold（ENIG） is different from the crystal structure formed by gold plating. Immersion gold boards are easier to weld than gold-plated boards and will not cause poor welding;

2. The immersion gold （ENIG）board only has nickel and gold on the pad, and the signal transmission in the skin effect is on the copper layer without affecting the signal.

3. Immersion gold （ENIG）is denser than gold-plated crystal structure, and it is not easy to oxidize;

4. The immersion gold （ENIG）PCB board only has nickel and gold on the pads, and will not produce gold wires that cause shortness;

5. The immersion gold （ENIG）PCB board only has nickel and gold on the pad, and the solder mask and the copper layer on the circuit are more firmly combined;

6. Immersion gold （ENIG）is golden yellow, more yellow and better-looking than gold plating;

7. Immersion gold （ENIG）is softer than gold plating, so it is not as good as gold plating in terms of wear resistance. For gold finger plates, the effect of gold plating is better.