Treatment before copper sinking Deburring: The pre-copper substrate goes through the drilling process. Although this process is prone to burrs, it is the most important hidden danger of metallization of inferior holes. It must be solved by the deburring process. Usually mechanical methods are used to make the hole edge and inner hole wall free […]

The main reason for the reserved board edge in the production of Rigid-flex PCB is that the SMT placement machine track is used to clamp the circuit board and flow through the placement machine, so components that are too close to the edge of the track are sucked by the SMT placement machine. When the components […]

Basics of Heat Transfer On a fundamental level, discussion about heat transfer includes two topics: temperature and heat flow. Temperature indicates the level of thermal energy that’s available, while heat flow says that thermal energy moves from one place to another. You will come across a few material properties that can modulate heat quite effectively […]

1.Power layout and wiring related The current required by digital circuits is often discontinuous, so inrush current will be generated for some high-speed devices. If the power traces are very long, high frequency noise due to inrush current can be introduced, and this high frequency noise can be introduced into other signals. In high-speed circuits, […]

What is FPC flexible board ink? FPC is a flexible circuit board, and FPC flexible board ink is an ink with bending resistance. In the past, FPC was produced with cover film, that is, dry film. Now many flexible circuit boards are produced with photosensitive ink or thermosetting ink, so circuit board ink is also […]

1.FPC Board cut Except for some materials, the materials used in flexible printed boards are basically rolls. Since not all processes must be processed by the tape-and-reel process, some processes must be cut into sheets for processing, such as the drilling of metallized holes of double-sided flexible printed boards, which can only be drilled in […]

In general, the stack-up design mainly follows two rules: Each trace layer must have an adjacent reference layer (power or ground); The adjacent main power supply layer and ground layer should maintain a minimum distance to provide larger coupling capacitance; The stackup from two-layer board to eight-layer board is listed below for example: Lamination of […]

The emergence of flexible and rigid boards provides a new connection method for the interconnection of electronic components. With the development of electronic information technology and people’s needs for electronic equipment, it tends to be light, thin, short, and multi-functional. Rigid-Flex printed circuit boards are designed to provide solutions, and act as replacements for rigid […]

Flexible Printed Circuit (FPC) has the advantages of being soft, light, thin and flexible. With the rapid trend of light, thin, short and small electronic products, it has been widely used in notebook computers, Digital related, mobile phones, LCD monitors, etc. The traditional FPC board material is mainly based on the three-layer structure of PI […]

When designing a PCB, we often rely on previous experience and tips found online. Some rules are general at design time, and some rules can only be used for a specific design. For example, analog-to-digital converter PCB rules do not apply to RF and vice versa. However, certain guidelines can be considered general to any […]