The process of Flexible PCB (FPC) board includes exposure, PI etching, opening, electrical testing, punching, appearance inspection, performance testing and so on. The production process of the FPC soft board is related to the performance of the Flexible PCB (FPC). After the production is completed, it needs to be tested to screen out the unqualified Flexible PCB (FPC) board to ensure that the Flexible PCB (FPC) maintains good performance in the application and plays the best role. In the Flexible PCB (FPC) board test, a high-current shrapnel micro-needle module with conduction and connection functions can be used to ensure the stability and efficiency of the Flexible PCB (FPC) soft board test.

In the Flexible PCB (FPC) board process, the exposure is to transfer the circuit pattern to the board through the function of the dry film. It is usually carried out by the photosensitive method. After the exposure is completed, the circuit of the Flexible PCB (FPC) board is basically formed. The dry film can transfer the image, but also Protect the circuit during the etching process. PI etching means that under certain temperature conditions, the etching solution is evenly sprayed on the surface of the copper foil through the nozzle, and the oxidation-reduction reaction occurs with the copper, and then the circuit is formed after the stripping treatment. The purpose of the opening is to form the original conductor circuit and the interconnection circuit between the layers. The opening process is often used for the conduction connection of the upper and lower layers of the double-layer Flexible PCB (FPC).

In addition to the service life, reliability performance and environmental performance of the Flexible PCB (FPC) soft board, the performance test of Flexible PCB (FPC) also includes folding resistance, flex resistance, heat resistance, solvent resistance, solderability, peeling performance, etc. .

The folding resistance and flex resistance of the Flexible PCB (FPC) soft board are related to the material and thickness of the copper foil, the type and thickness of the glue used for the base material, and the material and thickness of the insulating base material. In the Flexible PCB (FPC) soft board assembly process, the double-layer and multilayer Flexible PCB (FPC) copper foils have good symmetry when they are pressed together, so the bending resistance and bending resistance will be better.

The Flexible PCB (FPC) soft board performance test requires professional equipment. Among them, the high-current shrapnel microneedle module has a stable conduction effect. Its integrated shrapnel design has the characteristics of high overall accuracy and good electrical conductivity. During transmission, it can carry current in the range of 1-50A, and has reliable overcurrent capability. The current flows in the same material body, the voltage is constant, the current has no attenuation, and the performance is stable and reliable.

In small pitches, the high-current shrapnel micro-needle module can cope with the pitch value between 0.15mm-0.4mm and maintain a stable connection. The pin is not stuck and the needle is constantly needled, and the performance and service life are excellent. After the shrapnel is gold-plated and hardened, the average service life can reach more than 20w times, which can greatly improve the test efficiency of the Flexible PCB (FPC) soft board, and it does not need to be replaced frequently in high-frequency tests, so material waste and unnecessary losses can be avoided.

For Flexible PCB (FPC) testing, both in terms of performance and cost performance, high-current shrapnel microneedle modules are a very reliable choice, with irreplaceable advantages, which can guarantee the stability of the test and have a long service life. It can improve the testing efficiency of Flexible PCB (FPC) and ensure the quality of Flexible PCB (FPC).