HDI PCB Board Definition:
HDI is the abbreviation of High Density Interconnector. It is a kind of printed circuit boards with special production technology. It is a printed circuit board with a relatively high line distribution density using micro-blind and buried via technology.
BETON PCB factory specialize in HDI PCB production over 14 years
BETON PCB factory focus on HDI PCB board production for over 14 years and we have complete production process for HDI PCB board, with advanced production equipments and capability, professional engineer team for HDI PCB Cam, and rich production experience for all questions meet need to improved during HDI board production process, all those make our HDI PCB board have win great reputation from customers all around the world for both high quality and lowest price level. So any HDI PCB board need production please contact us freely or Quote online in our website！Email address: [email protected] .This article we mainly shows you the 2+N+2 HDI with gold finger production process for your reference.and let you know how the HDI PCB board manufactured in BETON PCB factory.
1. Project data processing
After the HDI PCB order is received from customer, the production order will be transferred to the project after evaluation and pre-examination. The project will be produced according to the production specifications. CAM data will be produced. The produced blockbuster data and MI will be issued for production. The production will be produced according to MI requirements.
2. Cutting
Purpose: According to the requirements of the engineering data MI, the large sheets that meet the requirements are cut into small pieces to produce panels. Small sheets that meet customer requirements.
Process: large sheet → cutting board according to MI requirements → curium board → beer fillet\grinding → board out
3. Baking board
Purpose: to remove the moisture in the board, eliminate the internal stress of the PCB board, stabilize the size of the board, and prevent the board from warping
Process: turn on the oven → put the plate → turn on the power switch of the oven → set the baking plate parameters (usually 4 hours) → baking plate → cooling → sequence
4. Stick dry film
Purpose: It is a polymer compound, which can produce a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance attached to the plate surface, thereby achieving the function of blocking electroplating and etching.
Process: inspection→filming→cutting film→insertion rack→standstill→waiting for alignment
5. LDI line
Purpose: Laser direct imaging technology is to use laser to directly scan and expose images on PCB substrates printed with photosensitive materials
Process: prepare film materials-exposure
Description of key steps: Film attribute is negative film production
6. Acid etching
Purpose: Etching is to use a chemical reaction method to corrode the copper layer of non-circuit parts
Process: plate loading→compensation etching→etching 1→etching 2→pickling→overflow washing (1-3)→clean water washing→dry plate combination
7. OPE punching
Purpose: Use CCD to capture the target graphics and punch holes on the board through a fixed mold.
Process: boot → adjust mold → find target center → run punching → check
8. AOI scanning inspection board
Purpose: Use AOI data to set relevant parameters and scan the board surface. During scanning, the actual board surface data will be compared with the AOI data data to find out defects
Process: download CAM data → make AOI data → set parameters → alignment → light correction → check the first board → confirm the error point → repair the board
Description of key steps: Steps 2 to 8 of the process are the production process of L3 and L4, L5 and L6 image
9. Browning
Purpose: 1. Prevent oxidation of the copper surface. 2. Increase the roughness of the copper surface 3. Strengthen the bonding of PP and the inner layer board
Process: Pickling → Circulating Water Washing → Blow Drying → Alkaline Washing → Water Washing → Pre-invasion → Browning → Circulating Water Washing → Pure Water Washing → Blow Drying → Drying → Blow Drying → Cooling → Unloading
Key step description: browning parts L3 and L4, L5 and L6
10. Pressing/Lamination
Purpose: Use high temperature and high pressure to melt the prepreg by heating, make it flow, and then turn it into a cured film. Thereby, one or more inner etched boards (after blackening or browning treatment) and copper foil are bonded into a multilayer board
Process: After browning, the inner core board + prepreg + copper skin → fusion, riveting → pre-arrangement → board arrangement → lamination → dismantling
11. X-RAY drill target
Purpose: Use the X-RAY target drilling machine to drill three or more target holes designed for drilling and positioning after pressing and measuring expansion and contraction and layer deviation.
12. Milling the frame and edging
Purpose:
A. Edge milling: Use the edge milling machine (gong edge machine) to import the designed rough gong mold to gong off the board edges (excess board edges) with overflowing glue to make the board edges neat
B. Edging: The milled-edged board is polished by the edging equipment to prevent the hidden dangers of scratches and scratches in the subsequent process.
13. Desmear
Purpose: Under high-temperature alkaline conditions, use the strong oxidizing properties of potassium permanganate to oxidatively decompose the resin carbon chains on the surface of the pores, and remove the bulky and softened resin and slag to expose the pore walls and form a honeycomb rough structure. Direct bonding force between hole wall and chemical copper
Process: upper board → leavening → double washing → degumming → washing → neutralization → washing → drying → lower board
14. Copper layer thinning
Purpose: Through the micro-etching effect of the syrup on the copper surface, the thickness of the copper surface can be uniformly reduced to facilitate subsequent production
Process: board loading → pickling → water washing → copper reduction → drying → lower board
Key step description: double-sided thinning, copper thickness is reduced from 0.33oz to 7-9um
15. Laser drilling
Purpose: By absorbing the energy of the CO2 infrared laser, ablating away the material to be processed to form a semi-enclosed space blind hole shape
Process: adjust drilling parameters → measure laser energy → load board → adjust program → do GCOM compensation → find laser target → drill board → lower board → inspect board
16. Drilling
Purpose: According to engineering data, use mechanical cutting to form necessary holes on PCB.
Process: stacking plate → drilling → self-inspection → grinding and piercing the front → inspection → next process
17. Sink copper
Purpose: Use a chemical method to deposit a conductive copper layer on the catalyzed pore wall resin to achieve electrical interconnection between layers. It itself is a kind of self-catalyzed redox reaction. In the chemical reaction process, the electrons emitted by the reducing agent are oxidized, and the copper ions get electrons to reduce to metallic copper. The new copper still has autocatalytic ability, so that the copper sinking reaction can be Ongoing.
Process: upper plate → expansion → water washing → degreasing residue → neutralization → adjustment (degreasing 2 degreasing 1) → micro-etching → pre-dip activation → acceleration → chemical copper deposition → water washing lower plate
18. Full board plating
Purpose: Full-board electroplating is to thicken the copper layer of the hole wall and the surface copper layer of the hole metalized board to the thickness required by MI to resist the corrosion of various chemical solutions in the subsequent processing process, and prevent the hole in the hole and no copper The occurrence of the phenomenon.
Process: pickling acid (0.5~1% H2SO4)→upper board→ pickling acid (3~5% H2SO4)→copper plating→washing→lower board
19. Paste dry film
Purpose: It is a polymer compound, which can produce a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance attached to the plate surface, thereby achieving the function of blocking electroplating and etching.
Process: inspection→filming→cutting film→insertion rack→standstill→waiting for alignment
20. LDI line
Purpose: Laser direct imaging technology is to use laser to directly scan and expose images on PCB substrates printed with photosensitive materials
Process: prepare film materials-exposure
Key step description: Film attribute is negative film production
21. Acid etching
Purpose: Etching is to use a chemical reaction method to corrode the copper layer of non-circuit parts
Process: board loading→compensation etching→etching 1→etching 2→pickling→overflow washing (1-3)→clean water washing→dry board combination
22. AOI scanning inspection board
Purpose: Use AOI data to set relevant parameters and scan the board surface. During scanning, the actual board surface data will be compared with the AOI data data to find out defects
Process: download CAM data → make AOI data → set parameters → alignment → light correction → check the first board → confirm the error point → repair the board
Description of the key steps: Steps 9 to 22 of the process are the production processes of L2 and L7.
23. Browning
Purpose: 1. Prevent oxidation of the copper surface. 2. Increase the roughness of the copper surface 3. Strengthen the bonding of PP and the inner layer board
Process: Pickling → Circulating Water Washing → Blow Drying → Alkaline Washing → Water Washing → Pre-invasion → Browning → Circulating Water Washing → Pure Water Washing → Blow Drying → Drying → Blow Drying → Cooling → Unloading
Key steps description: browning parts L2 and L7
24. Pressing/Lamination
Purpose: Use high temperature and high pressure to melt the prepreg by heating, make it flow, and then turn it into a cured film. Thereby, one or more inner etched boards (after blackening or browning treatment) and copper foil are bonded into a multilayer board
Process: After browning, the inner core board + prepreg + copper skin → fusion, riveting → pre-arrangement → board arrangement → lamination → dismantling
25.X-RAY drill target
Purpose: Use the X-RAY target drilling machine to drill three or more target holes designed for drilling and positioning after pressing and simultaneously measuring expansion and contraction and layer deviation
26. Milling frame, edging
Purpose:
A. Edge milling: use the edge milling machine (gong edge machine) to import the designed rough gong mold to gong off the board edges (excess board edges) with overflowing glue to make the board edges neat
B. Edging: The milled-edged board is polished by the edging equipment to prevent the hidden dangers of scratches and scratches in the subsequent process.
27. Desmear
Purpose: Under high-temperature alkaline conditions, use the strong oxidizing properties of potassium permanganate to oxidatively decompose the resin carbon chains on the surface of the pores, and remove the bulky and softened resin and slag to expose the pore walls and form a honeycomb rough structure. Direct bonding force between hole wall and chemical copper
Process: upper board → leavening → double washing → degumming → washing → neutralization → washing → drying → lower board
28. Copper layer thinning
Purpose: Through the micro-etching effect of the syrup on the copper surface, the thickness of the copper surface can be uniformly reduced to facilitate subsequent production
Process: board loading → pickling → water washing → copper reduction → drying → lower board
Key step description: copper thickness is reduced to 7-9um
29. Laser drilling
Purpose: By absorbing the energy of the CO2 infrared laser, ablating away the material to be processed to form a semi-enclosed space blind hole shape
Process: adjust drilling parameters → measure laser energy → load board → adjust program → do GCOM compensation → find laser target → drill board → lower board → inspect board
30. Copper plating
Purpose: Use a chemical method to deposit a conductive copper layer on the catalyzed pore wall resin to achieve electrical interconnection between layers. It itself is a kind of self-catalyzed redox reaction. In the chemical reaction process, the electrons emitted by the reducing agent are oxidized, and the copper ions get electrons to reduce to metallic copper. The new copper still has autocatalytic ability, so that the copper sinking reaction can be Ongoing.
Process: upper plate → expansion → water washing → degreasing residue → neutralization → adjustment (degreasing 2 degreasing 1) → micro-etching → pre-dip activation → acceleration → chemical copper deposition → water washing lower plate
31. Full HDI board plating
Purpose: Full-board electroplating is to thicken the copper layer of the hole wall and the surface copper layer of the hole metalized board to the thickness required by MI to resist the corrosion of various chemical solutions in the subsequent processing process, and prevent the hole in the hole and no copper The occurrence of the phenomenon.
Process: pickling acid (0.5~1% H2SO4)→upper board→ pickling acid (3~5% H2SO4)→copper plating→washing→lower board
32. Resin plug hole
Purpose: Plating copper on the wall of the blind hole and then filling it with epoxy resin to ensure that the blind hole is plugged
Process: boot → set plug hole parameters → set scraper parameters → resin plug hole → check
Abrasive belt grinding
Purpose: After the resin is plugged into the hole, the edge of the hole and the board surface are smooth without residual glue
33. Copper layer thinning
Purpose: Through the micro-etching effect of the syrup on the copper surface, the thickness of the copper surface can be uniformly reduced to facilitate subsequent production
Process: board loading → pickling → water washing → copper reduction → drying → lower board
Description of the key steps: the surface copper is greater than 25um to be thinned, and the double-sided thickness is reduced to 15-25um
34. Drilling
Purpose: According to engineering data, use mechanical cutting to form necessary holes on PCB.
Process: stacking plate → drilling → self-inspection → grinding and piercing the front → inspection → next process
35. Sink Copper
Purpose: Use a chemical method to deposit a conductive copper layer on the catalyzed pore wall resin to achieve electrical interconnection between layers. It itself is a kind of self-catalyzed redox reaction. In the chemical reaction process, the electrons emitted by the reducing agent are oxidized, and the copper ions get electrons to reduce to metallic copper. The new copper still has autocatalytic ability, so that the copper sinking reaction can be Ongoing.
Process: upper plate → expansion → water washing → degreasing residue → neutralization → adjustment (degreasing 2 degreasing 1) → micro-etching → pre-dip activation → acceleration → chemical copper deposition → water washing lower plate
36. LDI line
Purpose: Laser direct imaging technology is to use laser to directly scan and expose images on PCB substrates printed with photosensitive materials
Process: prepare film materials-exposure
Key step description: film attribute is positive film production
37. Figure electric gold
Purpose: Pattern electroplating is to electroplate a copper layer with the required thickness and nickel-gold with the required thickness on the exposed copper skin or hole wall of the circuit pattern.
Process: upper plate → degreasing → micro-etching → pickling → copper plating → pickling → tin plating → prepreg → electro-gold → lower plate
38. Stick dry film
Purpose: It is a polymer compound, which can produce a polymerization reaction after being irradiated by ultraviolet rays to form a stable substance attached to the plate surface, thereby achieving the function of blocking electroplating and etching.
Process: inspection→filming→cutting film→insertion rack→standstill→waiting for alignment
Key step description: protect the non-golden finger area and the non-thick gold area
39. Electric gold finger
Purpose: Gold finger is also called plug gold plating, mainly to plate a semi-bright nickel plating layer and thin gold layer on the plug to improve the hardness and wear resistance of the metal layer at the plug and reduce the porosity of the metal layer
Process: Putting the board → pickling → activation I → DI water washing → nickel plating → water washing 2 → activation II → DI water washing → gold plating → recycling → DI water washing → drying → board connection (inspection)
image
40. Remove the film
Purpose: Use NaOH solution to remove the anti-electroplating coating film to expose the non-circuit copper layer.
Process: water film: insert rack → soak alkali → rinse → scrub → pass machine; dry film: release board → pass machine
41. Alkaline etching
Purpose: Copper chloride chemically removes the unnecessary copper layer in the pattern under alkaline conditions to form a circuit pattern, which is mainly used to etch the copper layer after pattern plating.
Process: loading board → film removal → water washing → alkaline etching → replenishing syrup cleaning → water washing → drying → removing lead tin → water washing → drying
42. Solder mask
Purpose: Leave the through holes and their pads on the board to be soldered, cover all circuits and copper surfaces, prevent short circuits during wave soldering, and save the amount of solder
Process: pre-treatment of solder mask→printing of solder mask ink→pre-baking→exposure→development→out board
43. Characters/ Silk Screen
Purpose: Silk-screen or jet-print the ink on the PCB to form a set character mark
Process: (screen printing process) screen printing → ink adjustment → cycle adjustment → screen printing → uv curing → plate out
(Printing process) Startup→retrieve cam data→change cycle→scanning and registering→printing
44. E-Test
Purpose: Check the electrical characteristics of the PCB: the continuity between nodes in the same network (open circuit) and the insulation of different networks (short circuit)
Process: release board → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → MRB → scrap
Key steps description: large board test
45. Routing
Purpose: through CNC routing machine forming the shape required by the customer.
46. V-CUT
Purpose: Cutting and processing V-shaped grooves on the circuit board to facilitate the processing and forming of a single circuit board. It is one of the circuit board connection methods
Process: check → install V-Cut knife → V-Cut → wash and dry → transfer to the next process
47. Hypotenuse
Purpose: The gold finger plug is beveled by a beveling machine according to the degree and excess thickness required by the customer, in order to facilitate the customer’s slot
Process: Inspect the incoming material and read the process card → adjust the bevel angle → use the same thickness of the scrap board as the first piece → check → bevel → self-check → transfer to the next process
48. Final inspection
Purpose: According to the factory inspection specification and the customer specified inspection basis, carry out the inspection of the PCB board
49. Packaging
Purpose: To conduct electrical test PASS (no function problem) and visual inspection PASS (no appearance problem), refer to customer packaging requirements for PCB boards with qualified board bending, according to the same PR, the same D/C, the same number, and the same nature of the PCB board
So any HDI PCB board need production please Contact us freely！Email address: [email protected] . Skype: [email protected] . WhatsApp number: +8613392412348